Site editor's note: When I first saw this book, I was afraid it was a “dumbed-down” book, a sort of “EE for Dummies” targeted at average Joe and Jane at home, making engineering seem almost trivially ...

Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...

Widely used as a genome editing tool, the CRISPR-Cas9 system allows researchers to precisely induce frameshift mutations in specific genes or insert foreign nucleic acid sequences into a cell’s DNA.