Innovative tool for producing computer chips uses giant, nearly perfect mirrors to make tiny transistors and circuits.

TSMC is expecting to start production of 3nm wafers at its second Japanese chip fab in 2028. The timeline was confirmed in a ...

Semiconductor manufacturer Xanoptix (Merrimack, NH) has developed a wafer-scale process for the 3-D stacking of silicon with either GaAs or InP to make compound semiconductors. The company's Hybrid ...

KLA rides booming wafer fab spending as AI chip demand surges, but rising costs, supply constraints and stiff competition ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

HONOLULU, June 12 /PRNewswire-FirstCall/ -- Before the start of the prestigious 2006 Symposium on VLSI Technology, Texas Instruments Incorporated (NYSE: TXN) (TI ...

Cerebras Systems and the federal Department of Energy's National Energy Technology Laboratory today announced that the company's CS-1 system is more than 10,000 times faster than a graphics processing ...

Tesla and SpaceX announced 'Terafab,' a $25 billion chip fab in Austin targeting 1 terawatt of compute. It's Battery Day on ...

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

The chip market is facing a wave of price increases, with IDM companies issuing hike notices and foundries preparing to raise prices for the 8-inch wafer process amid current supply-demand dynamics.

Germany-based engineering company Lidrotec has developed a novel laser dicing process alongside Trumpf, which has helped to scale the process for mass production of wafers using its laser and beam ...