LONDON--(BUSINESS WIRE)--The global fan-out wafer level packaging (FOWLP) market is expected to post a CAGR of almost 16% during the period 2019-2023, according to the latest market research report by ...

Samsung Electronics is advancing development of its next-generation System-on-Panel (SoP) packaging technology, aiming to produce modules significantly larger than those possible... Friday 18 July ...

(Nanowerk News) Imec engineers have, for the first time, demonstrated the fabrication of extremely small sealed cavities (less than one picoliter in volume), fabricated directly on 200mm silicon ...

Suss MicroTec announced that it has received “significant multiple orders” for its lithography production equipment from the ASE Group, a provider of independent semiconductor assembly and test ...

Incorporating the NanoResolution MRS sensor, the WX3000 Metrology and Inspection systems enable the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced ...

The market for portable and mobile data access devices that are wirelessly connected to the cloud anytime and anywhere is exploding. The trend to access any network from anywhere is driving increased ...

Advanced packaging is starting to gain traction as a commercially viable business model rather than just one more possible option, propelled by the technical difficulties in routing signals at 10nm ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

LONDON-- (BUSINESS WIRE)--Technavio has been monitoring the fan-out wafer level packaging market and it is poised to grow by USD 1.94 billion during 2020-2024, progressing at a CAGR of over 16% during ...

Dr. Navid Asadi’s group takes a look at wafer to panel level chip packaging. This is the six of a mutlipart series on chip packaging technologies. Navid Asadi is an assistant professor in the ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...